Information
- Bondexpo 2024
- International trade fair for bonding technology, Co-located with Motek.
- Oct 08 - Oct 11, 2024
- Stuttgart Exhibition Centre
- Stuttgart , Germany
- P.E. Schall Gmbh & Co. KG
- THETW Co., Ltd.
Market Introduction
【Bondexpo 2022】
There were 24,236 visitors from 864 countries and 505 exhibitors from 24 countries.
Overall floor space: 45,000 sqmExhibition Introduction
【About Bondexpo】
Bondexpo is the world’s number one industry and user meeting place. With a clear and consistent focus on the joining/bonding process chain through adhesive bonding, potting, sealing and foaming, the company offers cost-effective detailed and system solutions for current and future challenges in the field of joining and bonding a wide range of materials. This applies not least to new requirements in terms of resource conservation and material and energy efficiency through material mix/hybrid designs for lightweight construction or miniaturization for microsystem technology applications. Suppliers of adhesive bonding technology will find the ideal setting here to present themselves to a trade audience from the globalized world of production.
Exhibited Main Products List
- Assembly systems and basic systems
- Handling technology
- Process technology for joining, machining, inspection and
- identification
- Components for special machine manufacturing
- Software and services